High-precision ultrafast analysis of compound semiconductor wafers
Since the early days, Malvern Panalytical has worked in close collaboration with the compound semiconductor industry to turn XRD and XRF into ‘backbone’ metrology tools. Knowing and understanding the analytical problems of our customers helps us offer efficient and automated control solutions for R&D through to volume semiconductor production.
- X'Pert3 (X'Pert3 MRD and X'Pert3 MRD XL) is an XRD platform for high-resolution rocking curve, X-ray reflectivity, and ultrafast reciprocal map (URSM) analysis. It provides absolute and accurate information on crystal growth parameters such as material composition, film thickness, grading profile, phase, and the interface quality. Crystalline quality parameters such as mosaicity and defect density can also be estimated from such measurements. In addition, an MRD platform can also be used for high-resolution topographic imaging of defects in substrates and thin films. The instrument can be used both in research and production environment. In the production process, it can be combined with automatic wafer loading.
- XRF (2830 ZT) gives thickness and composition information for a wide range of thin films, with contamination and dopant levels and surface uniformity.