This live webinar will discuss the application of an advanced rheometric technique known as Controlled Stress Parallel Superposition (CSPS) to model screen printing inks and gelling materials. The theoretical background to CSPS will be discussed along with the challenges which must be overcome when applying the technique to materials with complex and/or transient microstructures. Validation data will be presented before the use of CSPS in the context of printed electronics is explored. The webinar targets those interested in understanding the rheological properties of materials with shear sensitive microstructures. Special attention will be given to gelling materials and screen-printing functional inks.