When joining metal surfaces together, the particle size and particle shape of the solder materials used is key to final product performance.

Solder materials are often applied through a screen or stencil and heated to melt the particles which then fuse to form a smooth metal bond. Incorrect particle size or shape can lead to unreliable printing, or increased oxidation resulting in poor bonds.

Malvern’s instrumentation makes it easy to measure particle size and particle shape during research and development and for quality control during solder manufacture in order to:

  • Improve final product performance
  • Optimize production processes
  • Improve production efficiency of printed circuit boards
  • Reduce solder bond failures.