Process control of aluminum interconnect deposition involves the analysis of AlCu films on a Si substrate, where the film thickness and Cu concentration have to be determined. Due to its excellent selectivity and precision, wavelength dispersive X-ray fluorescence spectrometry is the ideal technique for AlCu monitoring on wafers in IC manufacturing.

The PANalytical 2830 ZT determines layer composition, thickness, dopant levels and surface uniformity for a wide range of process films and stacks. 


Ainda não possui cadastro?

Sign up for free today. By registering you will have free access to exclusive content including

  • Webinars, presentations and videos
  • Application notes, technical notes, articles, white papers and software downloads

And in addition you will receive

  • Our regular eNews including the latest news, education, events and offers from Malvern Panalytical