How to achieve reproducible results across tools, time after time

In modern semiconductor production, where precision is critical, inconsistencies in measurement reproducibility can jeopardize process control, yield, and performance. Wavelength dispersive X-ray fluorescence (WD-XRF) is an important metrology technique that has been proven to meet strict criteria when it comes to reproducible results on an individual spectrometer. But measurement reproducibility is not always enough – often, results must be matched across various tools, in order to maximize throughput.

Malvern Panalytical’s ToolMatch software makes it possible to obtain closely matching results from different tools, improving the overall accuracy of your results for optimum quality and consistency.

How does it work?

ToolMatch software can be easily combined with application import/export software to create identical recipes on spectrometers, which, combined with Tool Matching corrections (TMC), provide almost indistinguishable results. Compared to manual matching, which can be time-consuming and often only able to be carried out by experts, this can now be activated and completed by a routine operator.

Because these measurements are activated by the routine operator, the need for expert intervention is significantly reduced. This avoids redundancy, prevents delays, and increases efficiency.

Without the need for manual correction by an operator, process efficiency is significantly improved.

Here’s how ToolMatch improves accuracy between multiple spectrometers, in four steps.

Step 1: A recipe (or “application”) is created in the analytical software SuperQ, with reference measurements including application, monitor, calibration standards, calibration, calibration update, wafer patterns, and TMC set from the original (“Mother”) tool.

Step 2: The complete recipe is transferred to the secondary (“Daughter”) tool via the Application Export/Import functionality, which is included in the ToolMatch software package.

Step 3: On the Daughter tool, all calibration wafers are measured under identical conditions as on the Mother tool, and the calibration is completed with the push of a button. Then, the measurement of the ToolMatch reference wafers is executed, including checks on the exact location of the wafer measurement.

Step 4: Correction lines are calculated based on the recipe from the Mother tool and the values measured on the Daughter tool. They are stored in a TMC set, which is used to correct future unknown measurements, enabling the same results to be achieved on the Daughter tool as on the Mother tool. If, despite instrument monitor correction, the quality check measurement fails, the ToolMatch measurements will bring the results back in line with the expected results.

Step 5: Run your routine measurements. ToolMatch corrections will be applied automatically.

Where do differences between spectrometers come from?

Today’s production control environment sets strict process demands, often well below 1% or even 0.1% relative. As a result, we may see differences between spectrometers, even though the spectrometers are maintained within the specifications.

For example, at signals that go from low to very high count rates, this could be caused by small deviations in the detector linearity (specified to be ±1% relative) or crystal properties. With ToolMatch, these differences can be automatically corrected.

See ToolMatch in action

In this application note, read about how ToolMatch can be used for an application containing Al, Cu, and Ti, which was measured on four different Malvern Panalytical 2830 ZT Wafer analyzers.

Want to learn more about optimizing your semiconductor workflow? Get in touch and we’ll help you build the analytical toolkit you need to power the future.