Date recorded: February 09 2010

Duration: 19 minutes 43 seconds

Particle size aned shape of the abrasive slurries used in silicon wafer cutting operations is important in defining the viscosity of the cutting fluid and the cutting effectiveness. Analysis during slurry use can aid production consistency and speed.
Table of contents
1. Abrasives - How size and shape of abrasive affects the efficiency of the wire saw cutting process
01:37
2. Abrasives - How size and shape of abrasive affects the efficiency of the wire saw cutting process
00:11
3. Semiconductor Wafers
00:25
4. Wire Saw Cutting
00:24
5. Wire Saw Abrasive
00:44
6. How to Characterize Abrasives
00:35
7. Sample Flow - Measurement
01:06
8. Flat Sheath Flow Formation
00:19
9. Particle Size Distributions
00:40
10. Volume vs. Number Distribution
01:13
11. Comparison to Traditional Methods
01:14
12. Comparison to Traditional Methods
00:53
13. Flow Particle Image Analysis
00:53
14. Abrasive Efficiency
00:51
15. Abrasives Characterization
00:48
16. Abrasives Shape and Performance
00:11
17. Abrasives – Fines Detection
00:56
18. Abrasives – Buildup of Fines
01:10
19. Recycling Abrasive Material
00:20
20. Recycling Abrasive Material
00:21
21. Benefits of Image Analysis
01:12
22. Conclusions
00:53
23. Contact Information
02:47