Process control of aluminum interconnect deposition involves the analysis of AlCu films on a Si substrate, where the film thickness and Cu concentration have to be determined. Due to its excellent selectivity and precision, wavelength dispersive X-ray fluorescence spectrometry is the ideal technique for AlCu monitoring on wafers in IC manufacturing.

The PANalytical 2830 ZT determines layer composition, thickness, dopant levels and surface uniformity for a wide range of process films and stacks. 

Login

 
  You need to provide a valid email address which will also be your username for the site.

Not registered yet?

Sign up for free today. By registering you will have free access to exclusive content including

  • Webinars, presentations and videos
  • Application notes, technical notes, articles, white papers and software downloads

And in addition you will receive

  • Our regular eNews including the latest news, education, events and offers from Malvern