In this report X-ray fluorescence and FP Multi are used to determine thickness and stoichiometry of TiNx thin films.
X-ray fluorescence spectrometry provides a non-destructive, highly reproducible and robust method of analyzing thin films on wafers. These attributes make XRF analysis a highly cost-effective method for the analysis of a large variety of films used in the semiconductor manufacturing process.
Not registered yet?
Sign up for free today. By registering you will have free access to exclusive content including
- Webinars, presentations and videos
- Application notes, technical notes, articles, white papers and software downloads
And in addition you will receive
- Our regular eNews including the latest news, education, events and offers from Malvern