How advanced crystal orientation tools are revolutionizing SiC manufacturing

Semiconductors are ubiquitous in today’s world, used as fundamental components in everything from smartphones and computers to cars and lighting. And as manufacturers face pressure to produce at high quantity, speed, and quality, the right technology can make or break the process.

Precision is everything

Precision is crucial to the wafer fabrication process, where even the slightest deviations in size or alignment can impact the finished product’s effectiveness and longevity. In silicon carbide (SiC) devices, misalignment between crystal orientation or wafer geometry and a process tool reference system can lead to suboptimal process performance or even failure in the front end.

Metrology is an essential practice in material characterization, measurement, and analysis, driving high performance and quality in manufacturing processes.

Firstly, metrology tools help enhance process control, yield enhancement, and innovation and development, by continuously monitoring and providing fast feedback. This ensures higher yield rates and the further expansion of this industry towards ever-decreasing feature sizes. Secondly, quality standards of semiconductor devices are strict and essential, whereby metrology ensures early identification of flaws or deviations from desired properties and allows early intervention in the processes to reduce the likelihood of defective devices. The non-destructiveness of X-ray metrology allows its integration into the processes without compromising the integrity of the sample.

Find out more about semiconductor metrology here.

The measurement methods you need to know

Cutting-edge systems like state-of-the-art X-ray technology provide unparalleled accuracy and speed in measuring the orientation and quality of SiC wafers and boules during their processing from seed to boule to wafer, via growth, grinding, slicing and polishing. With a combination of lasers, X-ray sources, and sophisticated optical algorithms, these systems can reliably determine the orientation of crystal axes, flatness, and edge profiles of SiC wafers.

X-ray diffraction (XRD)

XRD is a highly regarded, non-destructive analytical technique that is utilized to analyze a wide range of samples’ physical characteristics, including phase composition. It offers automation capabilities for batch processing, workflow-adapted sample transfer, and a user-friendly software interface for controlling and analyzing data.

In the context of wafer characterization, XRD can determine the orientation of crystal planes relative to the wafer surface, including the offcuts. Up to 100,000 wafers can be measured per year on a single tool, ensuring accurate orientation before growth, grinding, and subsequent processing steps.

Malvern Panalytical is at the forefront of XRD solutions for various needs across academic, research, and industrial settings. Our systems, including X’Pert3 MRD and X’Pert3 MRD XL, provide absolute, calibration-free, and accurate information on crystal growth, giving material composition, film thickness, grading profile, and phase and crystal quality.

Azimuthal scan

The azimuthal scan method offers a remarkable breakthrough in both speed and precision, with robust instrumentation and minimal moving parts. From checking seed quality before crystal growth to transferring orientation during grinding and cutting stages, azimuthal scan measurements streamline operations, ensure the highest level of accuracy and quality control, and can be seamlessly integrated into various stages of the wafer production process.

During the scan, the sample is rotated 360° and intensity peaks are recorded, providing comprehensive data on both tilt magnitude and direction, as well as in-plane directions within the crystal, all within 10 seconds. This method not only significantly reduces measurement time but also offers unparalleled accuracy, with precision down to 0.01°.

The azimuthal scan method can be applied across various stages of semiconductor production. It ensures the correct orientation of seed crystals, facilitates accurate grinding and cutting of ingots into wafers, and enables thorough quality inspection of semiconductor materials.

The latest crystal orientation measuring equipment is revolutionizing the crystal tolerances of wafers and ingots, facilitating the transfer to grinding and slicing, and feeding forward into subsequent process steps. Malvern Panalytical’s crystal orientation range, such as the Omega Theta diffractometer and the Wafer XRD 200/300, use the azimuthal scan to reach new levels of speed and accuracy in semiconductor production.

Take your semiconductor manufacturing to the next level

Crystal orientation measurement techniques are not just beneficial for silicon-based semiconductors but also for various single-crystalline materials, enhancing efficiency, precision, and overall product quality in semiconductor manufacturing. Find out more in this article.