Non-ambient chambers

In situ X-ray analysis, often referred to as analysis at non-ambient conditions, is one of the key applications for advanced material research in both academic and industrial environments.

Any macroscopic property of a material is directly related to its structural property (e.g. crystallographic symmetry, crystallite size, vacancies, size and shape of nanoparticles or pores). Temperature, pressure, varying gas atmosphere and mechanical stress trigger phase transformation, chemical reactions, recrystallization and so on.

X-ray diffraction (XRD) and X-ray scattering techniques are the first and sometimes the only choice for the correct and accurate in situ characterization of these changes. Whether it is for an optimization of a manufacturing process or tuning of a synthesis procedure, or for state-of-the-art research and creation of new materials, in situ X-ray analysis is the most comprehensive tool for problem solving.

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HTK 16N – strip heater

For powder XRD in reflection geometry with rapid heating to 1600 ºC.

HTK 1200N – oven heater

For powder XRD in transmission and reflection geometry, basic stress, SAXS, PDF and thin film analyses at temperatures to 1200 ºC.

HTK 2000N – strip heater

For powder XRD in reflection geometry with rapid heating to 2000 ºC.

TTK 600 – low-temperature chamber

For powder XRD in reflection and transmission, basic stress and thin film analysis in the temperature range -190 °C to +600 °C.

CHC plus+ – cryo and humidity chamber

For powder XRD in reflection, basic stress and thin film analysis with controlled temperature and humidity.

Phenix – low-temperature cryostat

For powder XRD in reflection, basic stress and thin film analysis in the temperature range from - 261 °C (12 K) to + 25 °C (298 K).

Cryostream Plus compact

For powder XRD, basic SAXS and PDF in capillary geometry in the temperature range from -193 ºC (80 K) to 227 ºC (500 K).

Chimera – cooling and heater chamber

For powder XRD in reflection, basic stress and thin film analysis in the temperature range from -203 ºC (70 K) to 252 ºC (525 K).

XRK 900 – reactor chamber

For powder XRD in reflection, basic stress and thin film analysis at temperatures to 900 ºC and pressures to 10 bars with various gases.

DCS 500 – domed cooling stage

For advanced thin film analysis and stress measurements at temperatures from -180 ºC to 500 ºC.

DHS 1100 – domed hot stage

For advanced thin film analysis, stress, texture and basic powder XRD in reflection at temperatures to 1100 ºC.

BTS 150/500 – benchtop heating stages

Anton Paar BTS 150 and BTS 500 benchtop heating stages, a low cost solution for in situ XRD (-10 °C to +500 °C).

Download the leaflet for an overview of the non ambient attachments and their field of application.