X'Pert³ - Support
The improved X’Pert platform
The successful X'Pert platform is continued by the Malvern Panalytical’s X'Pert³ range of X-ray diffraction systems. With new on-board control electronics, compliance with the latest and most stringent X-ray and motion safety norms, advances in eco-friendliness and reliability the X'Pert³ platform is ready for the future.
• Longest lifetime of incident beam components with CRISP
• Maximum uptime with pneumatic shutters and beam attenuators
• Easy extension towards new applications thanks to 2nd generation PreFIX technology
• Rapid, reliable tool-free exchange of tube focus position
• New on-board control electronics with direct internet connection
• Compliance with the most stringent safety regulations
Supported products
X'Pert³ MRD
Versatile materials research diffraction system
- Measurement
-
Epitaxy analysis
Interface roughness
Phase identification
Phase quantification
Reciprocal space analysis
Residual stress
Texture analysis
Thin film metrology
- Wafer mapping
- 100 mm
- C-to-C wafer loader
- No
- Goniometer configuration
- Horizontal goniometer, Θ-2Θ
- Minimum step size
- 0.0001º
- Technology
-
X-ray Diffraction (XRD)
X'Pert³ MRD XL
Versatile materials research diffraction system
- Measurement
-
Epitaxy analysis
Phase identification
Phase quantification
Thin film metrology
Residual stress
Texture analysis
Reciprocal space analysis
Interface roughness
- Wafer mapping
- 200 mm
- C-to-C wafer loader
- Yes
- Goniometer configuration
- Horizontal goniometer, Θ-2Θ
- Minimum step size
- 0.0001º
- Detector
- PIXcel1D, PIXcel3D, Proportional counter, Scintilation detector
- X-ray tube anode material
- Cu, Co,Cr, Mn, Fe, Mo
- Technology
-
X-ray Diffraction (XRD)
X'Pert³ Powder
The next generation cost-effective, multipurpose X-ray diffraction platform
- Measurement
-
3D structure / imaging
Contaminant detection and analysis
Crystal structure determination
Interface roughness
Phase identification
Phase quantification
Pore size distribution
Residual stress
Surface area
Thin film metrology
- Wafer mapping
- No
- C-to-C wafer loader
- No
- Goniometer configuration
- Vertical goniometer, Θ-Θ
- Minimum step size
- 0.001º
- Detector
- PIXcel3D, Proportional counter, Scintilation detector
- X-ray tube anode material
- Cu, Co,Cr, Mn, Fe, Mo, Ag
- Technology
-
X-ray Diffraction (XRD)