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X'Pert³

Versatile research and development XRD system

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The successful X'Pert platform is continued by the Malvern Panalytical’s X'Pert³ range of X-ray diffraction systems. With new on-board control electronics, compliance with the latest and most stringent X-ray and motion safety norms, advances in eco-friendliness and reliability the X'Pert³ platform is ready for the future.

  • Longest lifetime of incident beam components with CRISP 
  • Maximum uptime with pneumatic shutters and beam attenuators 
  • Easy extension towards new applications thanks to 2nd generation PreFIX technology 
  • Rapid, reliable tool-free exchange of tube focus position 
  • New on-board control electronics with direct internet connection 
  • Compliance with the most stringent safety regulations
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X'Pert³ MRD

The X'Pert³ MRD systems offer advanced and innovative X-ray diffraction solutions from research to process development and process control.

Features include

  • Wafer max. diameter: 100 mm
  • SECS/GEM
  • Cleanroom ISO 4
X'Pert³ MRD

X'Pert³ MRD XL

An extra PreFIX mounting platform allows mounting of an X-ray mirror and a high-resolution monochromator in-line, increasing significantly the intensity of the incident beam.

Features include

  • Wafer max. diameter: 300 mm
  • SECS/GEM
  • Cleanroom ISO 4
X'Pert³ MRD XL

How our products compare

  • X'Pert³ MRD

    Versatile research & development XRD system

    X'Pert³ MRD

    Technology

    • X-ray Diffraction (XRD)

    Measurement type

    • Phase identification
    • Phase quantification
    • Thin film metrology
    • Residual stress
    • Interface roughness
    • Epitaxy analysis
    • Texture analysis
    • Reciprocal space analysis

    Wafer max. diameter

    • 100 mm
    • SECS/GEM
    • Cleanroom ISO 4
    More details Request a quote

  • X'Pert³ MRD XL

    Versatile research, development & quality control XRD system

    X'Pert³ MRD XL

    Technology

    • X-ray Diffraction (XRD)

    Measurement type

    • Phase identification
    • Phase quantification
    • Thin film metrology
    • Residual stress
    • Interface roughness
    • Epitaxy analysis
    • Texture analysis
    • Reciprocal space analysis

    Wafer max. diameter

    • 300 mm
    • SECS/GEM
    • Cleanroom ISO 4
    More details Request a quote