Thin film metrology solutions 

The advancement in materials research and semiconductor technology have brought great changes to the way we live. They have driven developments in almost every aspect of our routine daily life – phones, smart wearables and toys, laptops, wireless network, home infotainment systems, cars, and smart meters. 

The semiconductor industry has rapidly advanced over the years, and the rate of change continues to gather momentum. This places considerable challenges to metrology techniques used in R&D and to control the manufacturing process – instrumentation must keep pace with developments and meet ever more rigorous technology demands. 

Growth technologies now allow the deposition of multi-layered structures with individual layers exhibiting thicknesses from microns down to monolayers. Typical materials that are involved in advanced thin film devices are semiconductors, metal alloys, dielectrics and polymers. In all kind of thin film structures, multiple measurements are often required to investigate properties such as layer thickness, crystallographic phase and alloy composition, strain, crystallinity, density, and interface morphology. 

To design, understand, and improve new devices, it is essential to measure key structural properties at every stage of the multi-step fabrication process. Controlling the layer properties is an essential step in research, development, and production of thin film devices as these thin films structures are at the heart of many advanced functional devices for communication, PC, consumer electronics, automotive, and advanced electronics for medical, industrial, and government applications. 

Particle size solutions  

Ensuring the correct particle size, particle shape and zeta potential of abrasive slurries used for the cutting and polishing of semiconductor wafers is essential to ensure efficient manufacture and product quality: a single oversize particle can damage the surface of a whole wafer. Furthermore, the costs of this material mean that it has to be closely monitored so that abrasive slurry is replaced at the optimal time.

Malvern Panalytical’s easy-to-use material characterization instrumentation can help you:

  • Optimize the dispersion of slurries
  • Prevent costly defects by detecting aggregates or oversized particles
  • Monitor the quality of a slurry and determine when it needs replacing
  • Optimize the recycling process of slurry components